2.5D & 3D Semiconductor Packaging Market – Trends Forecast Till 2030

Market Snapshot

Market Overview

The global 2.5D & 3D Semiconductor Packaging Market size is projected to reach a CAGR of 17.7% from 2023-2030.

2.5D/3D are packing methodologies for including numerous IC inside the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve significantly high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint.

The growth of the market is attributed to the growing consumption of semiconductor devices across several industries. Additionally, increasing demand for compact, high-functionality electronic devices is also going to drive the market. Furthermore, the growing adoption of high-end computing, servers, and data centers is going to provide the market with new opportunities. 

On the other hand, high initial investment and increasing complexity of semiconductor IC designs is the major restraining factor for the market.

A pandemic like COVID-19 is anticipated to fuel the manufacturing of advanced medical devices and equipment to tackle such crises in the future. For instance, in 2021, GE Healthcare announced that it would increase its manufacturing capacity for medical equipment, including CTs, ultrasound devices, mobile X-ray systems, patient monitors, and ventilators, to cater to the ongoing challenge of treating COVID-19 patients. Since 2.5D & 3D Semiconductor Packaging has numerous applications in the medical industry, the proliferation of medical equipment manufacturing is expected to drive market growth.

Delvens Industry Expert's Standpoint

Regarding the qualities, integration, and energy efficiency of the product, semiconductor packaging has undergone constant change and transformation. Suppliers of semiconductor packaging are creating processes and plan to reduce the total cost of advanced packaging and give the highest operational effectiveness with the semiconductor market growing and expanding. Additionally, the market is continuously undergoing improvements and advancements for improving packaging solutions. The market for smartphones is expanding, wearables and smart devices are becoming more popular, and consumer IoT device penetration is developing in applications like smart homes having a major influence on this market. The 5G smartphones with increased silicon content are also expected to increase in the coming future giving a further boost to the market.

Market Portfolio

Key Findings

• 2.5D/3D are packing methodologies for including numerous IC inside the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve significantly high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint.
   
• The growth of the market is attributed to the growing consumption of semiconductor devices across several industries. Additionally, increasing demand for compact, high-functionality electronic devices is also going to drive the market. Furthermore, the growing adoption of high-end computing, servers, and data centers is going to provide the market with new opportunities.
   
• The market is also divided into various regions such as North America, Europe, Asia-Pacific, South America, and Middle East and Africa. The increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world due to factors such as rising population, increasing disposable income, and growing urbanization.

Regional Analysis

Asia Pacific to Dominate the Market          

• The increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world due to factors such as rising population, increasing disposable income, and growing urbanization.
   
• Additionally, the region is projected to witness rapid growth due to the increased demand for miniaturized circuits and the presence of established semiconductor manufacturing companies, OEMs, and ODMs.

Competitive Landscape

• Amkor Technology
• ASE group
• Siliconware Precision Industries Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• SÜSS MicroTec AG.
• International Business Machines Corporation (IBM)
• Intel Corporation
• Qualcomm Technologies, Inc.
• STMicroelectronics
• Taiwan Semiconductor Manufacturing Company.

Recent Developments

• February 2022 - Shanghai Micro Electronics Equipment Group (SMEE), a Shanghai-based company, announced that it had delivered China's first advanced 2.5D/3D chip packaging stepper, which matches the advanced products in the same category. SMEE, a state-controlled semiconductor equipment company, reported that the new product aims to satisfy the need for the packaging of super-large chips used in high-performance computing (HPC) and high-end AI computing.
   
• November 2021 - South Korea's Samsung Electronics Co. unveiled a new chip packaging technology called H-Cube, which stacks high-performance chips in smaller sizes. The tech giant said that its latest 2.5D semiconductor chip packaging technology is available for clients in artificial intelligence (AI), data center, high-performance computing (HPC), and networking products that require high-performance, large-area packaging.

Reasons to Acquire

• Increase your understanding of the market for identifying the best and most suitable strategies and decisions on the basis of sales or revenue fluctuations in terms of volume and value, distribution chain analysis, market trends, and factors
   
• Gain authentic and granular data access for the 2.5D & 3D Semiconductor Packaging Market so as to understand the trends and the factors involved in changing market situations
   
• Qualitative and quantitative data utilization to discover arrays of future growth from the market trends of leaders to market visionaries and then recognize the significant areas to compete in the future
   
• In-depth analysis of the changing trends of the market by visualizing the historic and forecast year growth patterns

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